현대차 스몰캡 & 방산 담당 곽민정(Ph.D, Member of SPIE, Member of IEEE)

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TSMC’s entry into glass substrates competition with Intel and Samsung has prompted Taiwan chip equipment makers to form an alliance to develop machinery for the substrates, media report, noting glass substrates are necessary to help deal with heat given off by Nvidia’s AI chips. The alliance is called the E-core System Alliance of Glass Substrate Suppliers (translation). TSMC is also working on FOPLP (Fan-Out Panel Level Packaging) for Nvidia. https://www.digitimes.com.tw/tech/dt/n/shwnws.asp?id=0000701088_PZH1SO557QB3TC92EJNU2