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Engineering Design and Innovation Centre (Innovation and Design Programme/ MSc in Innovation and Design)
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Channel Posts
Reminder: TEA(M) UP! for 3301 ā RSVP by Tomorrow (Thursday, 10 Sept 2026)
Hi everyone,
A quick reminder that TEA(M) UP! for 3301 is happening next Wednesday.
š
Wednesday, 16 Sept 2026
š 2 PM ā 3 PM
š The Lodge, TechnoEdge Level 2
Come meet potential teammates for the next run of CDE3301 Ideas to Proof-of-Concept in 2027. Bring an idea, or just bring yourself and see what others are working on. Tea and light bites will be provided.
š RSVP by Thursday, 10 Sept 2026: https://forms.cloud.microsoft/r/bMhnKRvnW4
š¬ Join our Telegram group for project ideas and updates: https://t.me/+P6k5PhXPOBhmYzU1
See you there!
| 2 | From Bits to Bots: Innovation & Entrepreneurship Salon
AI is moving beyond the screen ā into robots, smart devices and intelligent machines. What are you going to build with it?
Join founders and innovation leaders from Singapore & Shenzhen/Greater Bay Area to explore Physical AI, hear how ideas become real-world products, and connect with potential collaborators.
š
22 Sep 2026 (Tue)
ā° 4:00ā6:00 PM
š i3 Building, NUS
š” Ideal for founders, engineers, researchers, product builders and anyone interested in AI, robotics, hardware & entrepreneurship.
š Limited spots ā register now via the QR code in the poster or here -> https://luma.com/uke97pga
Feel free to share this with anyone who might be interested. | 422 |
| 3 | š [NUS iDP Students] Synthetic Data Generation!!š¤šĀ
Ā
Looking for a high-impact UROP credit-bearing project that fulfills your academic requirements AND gives you global exposure?Ā
Ā
NUS EDIC is collaborating with Venture Corporation to recruit ambitious iDP students for a cutting-edge project:
š āSynthetic data generation for an industrial computer vision model developmentāĀ
Ā Ā
š Why join this project?Ā
Industry Mentorship: Work with and learn from the Venture Corporation (based in Singapore).Ā
Career Fast-Track: Explore internship opportunities directly with Venture Corporation.Ā
Academic Credit: Fully satisfies your NUS UROP requirement.Ā
Ā
š
Key Timeline:Ā
Sep 2026 (Now!): Initial project briefing & prep workĀ
Sem 2 AY2026/2027: Official UROP enrollmentĀ
Ā
š© Interested?
Email Mr Ong Chiau Ho at š§ chiauho.ong@venture.com to indicate interest.Ā
(See attached file for full details!) š | 510 |
| 4 | ā° REMINDER | iDP Ć NOC EAT & CHILL šš
Just a reminder that our iDP Ć NOC Eat & Chill Sharing is happening this Wednesday 6-8pm!
š
9 Sep 2026 (Wed)
š E2A Studio 2
ā° Start 6:00 PM SHARP
Programme Highlights
š¤ NOC & iDP Alumni Sharing
š McChill & Chat ā Dinner & Networking
Whether you are already considering NOC or just starting to explore the opportunity, this is a great chance to understand what NOC is actually like, what you can gain from it, and how it could fit into your iDP journey.
š And yes ā the McDonaldās has already been ordered and is on the way! š
š Got a lecture and canāt make it for the full sharing?
The sharing session will be recorded, so you can catch up afterwards. Youāre still welcome to join us when your lecture ends for the Q&A, dinner and networking!
šØ SIGN-UP EXTENDED to Tomorrow, 8 Sep, 12:00 PM
Donāt miss the chance to connect with NOC alumni, the NOC team, iDP faculty and fellow students ā and enjoy dinner together! šš¤š
RSVP - iDPĀ Eat & Chill X NOC Alumni Sharing AY26/27 (September 9 2026) ā Fill out form | 654 |
| 5 |  š
Ā Key Timeline:Ā
Sep 2026 (Now!):Ā Initial project briefing & prep workĀ
Sem 2 AY2026/2027:Ā Official UROP enrollmentĀ
May 2027:Ā TE AI Cup Global CompetitionĀ
Ā
š©Ā Interested?
EmailĀ Keith Tan (EDIC)Ā atĀ š§Ā keithtcy@nus.edu.sgĀ to indicate interest.Ā
(See attached flyer for full details!)Ā š | 793 |
| 6 | Apply for a UROP Project with Application to Competition
Ā
šĀ [NUS iDP Students] Shape the Future of AI in Manufacturing!Ā š¤šĀ
Ā
Looking for a high-impactĀ UROP projectĀ that fulfills your academic requirements AND gives you global exposure?Ā
Ā
NUS EDICĀ is collaborating withĀ TE ConnectivityĀ (Fortune 500 Global Leader) to recruit ambitious iDP students for a cutting-edge project:
šĀ āAI/ML industrial copilot system for self-tuning manufacturing processāĀ
Ā
This project is earmarked for theĀ TE AI Cup 2027āa prestigious annual global competition!Ā
Ā
šĀ Why join this project?Ā
Industry Mentorship:Ā Work with and learn from the globalĀ TE AI Hub teamĀ (based in Singapore).Ā
Career Fast-Track:Ā ExploreĀ internship opportunitiesĀ directly with TE Connectivity.Ā
Global Accolades:Ā Compete for prizes and global recognition at the TE AI Cup.Ā
Academic Credit:Ā Fully satisfies yourĀ NUS UROP requirement. | 711 |
| 7 | Please send your CV via WhatsApp to 9011 7050, along with the position you are applying for and a note mentioning that you came across the opportunity through the NUS EDIC Telegram channel | 773 |
| 8 | Firmware Engineer Intern (Embedded System)
We are seeking for a motivated Firmware Engineer Intern to join our team! As a Firmware Engineer Intern, you will be responsible for assisting in developing firmware for one of our products. Your day-to-day task includes designing, implementing, and testing the firmware on a microcontroller on one of our future products. An electrical skill would be a plus as you might need to help the team design some simple electrical circuits and choose some electrical components to be used with the microcontroller.
Key Responsibilities:
Work closely with cross-functional teams to ensure project delivery on time.
Develop clean, modular, and robust firmware for our microcontroller.
Develop a communication protocol over UART, WIFI, and BLE.
Develop a driver for multiple sensors and actuators over UART, I2C, SPI, CAN, etc.
Perform firmware testing on the product.
Generate and maintain firmware development documentation.
Read simple schematics and utilise oscilloscopes and other test equipment in the development and debugging of firmware.
Research technical issues related to firmware and provide recommendations.
Participate in ad hoc software projects and assignments as required.
Qualifications:
Studying in a Bachelor of Electronic/Electrical/Computer Engineering, Computer Science, Software Engineering or related fields.
Has strong C/C++ skills and is familiar with Git and bash.
Has basic knowledge of electrical circuitry, and ability to read electrical schematics.
Has a basic understanding of embedded systems (microcontroller architecture, block diagrams, schematics, register maps, etc.)
Possesses clean, highly readable coding practices.
Knows the basic usage of debugging tools such as oscilloscope and logic analyser.
Excellent teamwork skills, flexibility, and ability to multitask.
Advantage:
Knowledge of hardware communication protocols such as UART, I2C, SPI, and CAN.
Experience with Python
Experience with Arduino / STM32 / ARM Cortex-based microcontrollers
Experience with FreeRTOS
Experience with PX4 and Ardupilot
Experience in implementing communication protocols over UART, WIFI (TCP), and BLE.
Experience with advanced robotics control and filtering (Kalman Filtering and PID)
Experience with debugging and interacting with electrical and mechanical hardware. | 772 |
| 9 | Internship opportunities for Avetics Global
Mechanical Engineering Intern [6 months] (University)
Avetics Global is a leading innovator in drone technology, known for our commitment to engineering excellence and cutting-edge technology. We specialize in drones and related products, and we strive to deliver high-quality solutions that meet our customers' needs. We're excited to offer an opportunity for a motivated Mechanical Engineering Intern to join our team and contribute to impactful engineering projects.
Role Overview:
The Mechanical Engineering Intern will work alongside our engineering team on the design, prototyping, and validation of mechanical systems for advanced field deployed hardware, from enclosure and housing design through to complex electro-mechanical assemblies, fabrication, and testing. This is a hands-on role covering manufacturing methods including 3D printing, composites, CNC, injection molding, and vacuum casting, and it offers real ownership on small components or sub-systems rather than shadow work. This isn't a one way internship. We provide structured training alongside project work and equip you with the skills and support to make you industry ready.
Key Responsibilities:
ā¢ āContribute to the design and development of mechanical and electro-mechanical components and assemblies, including CAD modeling, tolerance stack-up, and DFM considerations, while learning manufacturing methods such as 3D printing, composites, CNC, injection molding, and vacuum casting.
ā¢ āOwn or co-own a specific component or sub-assembly through its development cycle, from concept through prototype iteration to validated design.
ā¢ āBuild and test physical prototypes, including electro-mechanical systems such as motors, actuators, sensors, and wiring integration. Run structured experiments and analyze results to inform design decisions.
ā¢ āSupport engineering drawings, BOMs, and technical documentation to production ready standards, aligned with relevant international norms.
ā¢ āSupport design and documentation practices in line with applicable international standards and compliance requirements (e.g., ISO, IPC, RoHS/REACH) relevant to mechanical and electro-mechanical systems.
ā¢ āTroubleshoot mechanical and electro-mechanical issues on existing designs and propose corrective actions.
ā¢ āContribute to technical reports and design reviews with the engineering team.
ā¢ āResearch and evaluate new materials, processes, or components for potential adoption.
Qualifications:
ā¢ āCurrently pursuing a degree in Mechanical Engineering or related field.
ā¢ āProficiency in CAD software (SolidWorks preferred) with working knowledge of tolerancing and DFM principles.
ā¢ āBasic understanding of mechanical principles, materials science, and manufacturing processes (3D printing, composites, CNC, injection molding, vacuum casting).
ā¢ āExposure to electro-mechanical integration (motors, sensors, actuators, wiring/harnessing) is a plus.
ā¢ āAwareness of international engineering standards and compliance requirements (e.g., ISO, IPC, RoHS) is a plus.
ā¢ āStrong problem-solving skills and attention to detail, and comfortable working hands-on with physical prototypes.
ā¢ āAbility to work independently on owned tasks while collaborating within a small, fast-moving team.
ā¢ āFamiliarity with simulation/analysis tools (FEA, CFD) is a plus. | 699 |
| 10 | Hello everybody of Batch 2026, CONGRADUATIONS on graduating!!!
We created this channel (https://t.me/+pRn-2lo0cTZmOTll) to keep iDP batch of 2026 together after graduating. We will mainly use this group to blast out events and gatherings supported by NUS (we will naturally have money from the school š)
Rest assured, this will not be another spam channel, purely to keep everyone in our batch together. Please send out to every iDP telegram group you know that consists of iDP alumni that graduated this year.
This first event will likely be held May of 2027, just to eat and catchupš, if we hit the numbers (so please join), we will qualify for subsidies from the school š° | 799 |
| 11 |  š¢ TEA(M) UP! for 3301
Looking for teammates for the next run of CDE3301 Ideas to Proof-of-Concept in 2027? Join our casual mixer and meet potential teammates before the course begins!
š” Got an idea? Share it and find people from different disciplines who might want to build it with you.
š Looking for an idea? Meet others, hear what theyāre interested in, and join a project that catches your attention.
š¤ Just looking for teammates? Come by, get to know others, and start forming your CDE3301 team.
Tea, coffee, and light bites will be provided! šµāš„Ŗ
šļø Wednesday, 16 Sept 2026
ā° 2 PM to 3 PM
š The Lodge (TechnoEdge Level 2)
š RSVP / Sign-up by 11 Sept 2026: https://forms.cloud.microsoft/r/bMhnKRvnW4
Come with an idea ā or without one. Meet people, share possibilities, and maybe leave with your CDE3301 team!
(Note: There will be another event on Week 10 for you to learn more about the studios / industry-proposed projects that will be offered for CDE3301.) | 748 |
| 12 |  š iDP Ć NOC | EAT & CHILL SHARING šāļø
Thinking about NOC but not sure what itās really like? š
Come hear it straight from NOC alumni ā their experiences, takeaways, tips, and everything youāve been wanting to ask!
š¤ Alumni Sharing & Q&A
š McDonaldās Dinner
š
9 September 2026 (Wed)
š E2A Studio 2
š¤ Sharing starts: 6:00 PM SHARP
š Sign-up deadline: 7 Sep, 11:59 PM (midnight)
Come eat, chill, and find out what NOC is really like! šāØ
š Sign up here: click to sign up | 872 |
| 13 |  š iDP Ć NOC | EAT & CHILL SHARING šāļø
Thinking about NOC but not sure what itās really like? š
Come hear it straight from NOC alumni ā their experiences, takeaways, tips, and everything youāve been wanting to ask!
š¤ Alumni Sharing & Q&A
š McDonaldās Dinner
š
9 September 2026 (Wed)
š E2A Studio 2
š¤ Sharing starts: 6:00 PM SHARP
š Sign-up deadline: 7 Sep, 11:59 PM (midnight)
Come eat, chill, and find out what NOC is really like! šāØ
š Sign up here: click to sign up | 1 |
| 14 |  Invitation to guest lecture
You are cordially invited to attend the lecture byĀ Betty Chang:
Date & Time: 17 September, 18:30ā20:00
Location: SDE4, Level 5 Forum, Department of Architecture, National University of Singapore
BOA-SIA CPD Points: TBC
RSVP here:Ā https://bit.ly/nusdoa_Betty
Ā
Operating in the Badlands: Learning from Place, Building Relationships, and Rethinking Rural-Urban Futures Beyond Service Learning
What can declining mountain villages teach us about navigating an uncertain future? Collaborative Badlands is a decade-long university-community initiative based in the rural badlands of southern Taiwan. Through the lens of place-based education, this talk explores how faculty and students learn to navigate not only a challenging landscape, but also the boundaries between university and community, rural and urban, and knowledge and practice.
It asks how universities might extend beyond service learning to become active participants they engage withābuilding relationships, fostering mutual lea | 762 |
| 15 |  Discover how hard lessons from failed ventures can inspire better engineering design in Aaron Chooi's seminar. Learn about Economic Ecology Design, soft robotics, and turning promising ideas into viable real-world products. Attendance is free and no registration is required! | 767 |
| 16 |  Join us for this seminar with Dr. David Carmona-Moreno, whose work bridges AI, robotics, and engineering design, as he shares lessons from building end-to-end intelligent robotic systems for real-world deployment. Learn more about the multidisciplinary challenges of turning AI into functional robots, from household assistance platforms to the latest vision-language-action models. Attendance is free and no registration is required! | 841 |
| 17 | ICYMI: sign up to shadow current CDE3301 studios to find out more about what CDE3301 is actually like!
Examples of the studios may be found on this webpage (note that not all the studios/projects were eventually offered, and the studio timeslots generally apply in Semester 2 only):
https://cde.nus.edu.sg/edic/projects/cde3301-projects-2026/ | 1 295 |
| 18 | Sign up for the iDP Immersion Tour to explore iDPās spaces, workshops and facilities with hands-on activities along the way. Limited slots are still available, so submit your registration by end of tomorrow! | 1 044 |
| 19 | Invitation to Fireside Chat and Networking Lunch
Ā
Would like to extend an enthusiastic invitation to all iDP students to meet with our distinguished guests, Liz Upton, co-founder of Raspberry Pi (https://www.raspberrypi.com/) and Alasdair Allan, CTO of Negroni Venture Studios (https://negroniventurestudios.com/). Alasdair is also a former Raspberry Pi Executive. Do join us along with fellow founders, NOC alumni, and the NUS Enterprise community. More details of the touch-points are as follows.
Ā
Fireside Chat: "From IPO to Investor: Building What Comes Next"
11:00am ā 12:15pm, iĀ³ Building, Level 3
A moderated conversation covering the Raspberry Pi IPO journey, vertical integration as an investment thesis, women founders and the investment landscape, and board governance. Featuring Liz Upton, June Lee (Head APAC of Workato), and Goh Yiping (Co-founder & CEO of Formas.AI), moderated by Steve Leong from BLOCK71.
Please RSVP here:Ā https://luma.com/wjeskzpf
Ā
Networking Lunch
12:15pm ā 1:30pm
An informal opportunity to follow up on conversations from the morning's fireside chat and pitches, and to connect with the wider community over lunch.
Please RSVP here:Ā https://luma.com/ltzd467x
Ā
AMA Roundtable: "What Breaks First When You Scale Deep Tech?"
3:45pm to 5:00pm
An intimate session co-led by Alasdair, covering scaling, practical AI adoption, founder-investor alignment, and technology timing.
Please RSVP here:Ā https://luma.com/9wpq7cmr
P.S. Do be encouraged to bring your projects with Raspberry Pi products for the foundersā autographs, if you wish to. | 1 298 |
| 20 |  Shadowing of CDE3301 studios
No brochures, no guesswork ā just CDE3301 as it really is.
Curious about what CDE3301 is actually like? Come see it for yourself before you commit.
We're giving you the chance to sit in on a live studio session and get a real feel for the course ā how it runs, what you'll work on, and whether it's the right fit for you.
What you'll get:
š¹ A behind-the-scenes look at what CDE3301 offers
š¹ See a real studio session in action
š¹ Discover the kinds of projects you'll take on
š¹ Chat with current students and staff
Sign up via this link to express your interest, and the Studio Masters will let you know when you can join a studio session!
https://tinyurl.com/CDE3301-shadowing-2026 | 1 071 |
